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Manufacturing Technology in the Electronics Industry: An introduction


Manufacturing Technology in the Electronics Industry: An introduction
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Lieferzeit: 21 Werktage

  • 10198348


Beschreibung

1 Introduction to the electronics industry.- 1.1 A history of the electronics industry.- 1.2 The electronics market.- 1.3 Electronics manufacturing company structure.- 1.4 Test engineering and quality assurance.- 2 Electronic components.- 2.1 Component interconnection methods.- 2.2 Electronic components.- 2.3 Component packaging.- 2.4 Cabling.- 2.5 Component quality assurance.- 3 Electronic design.- 3.1 Quality and reliability assessment.- 3.2 The product design process.- 3.3 Circuit design.- 3.4 Integrated circuit design.- 3.5 Circuit layout.- 4 Semiconductor device manufacture.- 4.1 Semiconductor materials.- 4.2 Clean room requirements.- 4.3 Silicon wafer manufacture.- 4.4 Photolithography.- 4.5 Layer fabrication processes.- 4.6 Bipolar junction transistor fabrication.- 4.7 Field effect transistor fabrication.- 4.8 Integrated circuit packaging and testing.- 5 Printed circuit board manufacture.- 5.1 Printed circuit board types.- 5.2 Printed circuit board substrate materials.- 5.3 Printed circuit board substrate manufacture.- 5.4 Printed circuit board fabrication procedures.- 5.5 Single-sided printed circuit board manufacture.- 5.6 Double-sided printed circuit board manufacture.- 5.7 Multilayer printed circuit board manufacture.- 6 Printed circuit board assembly.- 6.1 Hand assembly.- 6.2 Automatic component insertion.- 6.3 Assembly-related faults.- 6.4 Soldering techniques.- 6.5 Solder joint inspection and common soldering faults.- 6.6 Cleaning.- 6.7 Testing and reworking.- 7 Surface mount component assembly.- 7.1 Advantages of surface mount components.- 7.2 Surface mount component assembly.- 7.3 Adhesive application.- 7.4 Solder paste application.- 7.5 Component onsertion.- 7.6 Soldering techniques.- 7.7 Mixing surface mount with leaded components.- 7.8 Soldering quality.- 7.9 Testing.- 7.10 Reworking.- 8 Alternative technologies.- 8.1 Hybrid technology.- 8.2 Tape automated bonding.- 8.3 Silicon on silicon wafer-scale integration.- 8.4 Application-specific integrated circuits.- 8.5 Flexible circuits.- References.- Further reading.

Eigenschaften

Breite: 153
Gewicht: 379 g
Höhe: 230
Länge: 14
Seiten: 248
Sprachen: Englisch
Autor: P. Edwards

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