Metallization of Polymers 2

1. Surface Analysis Using Confocal Ramam Micro-Spectroscopy; C. Hyett, et al. 2. Ellipsometric Characterization of the Optical Constants of Metals: Thin Films Versus Nanoparticles; D. Dalacu, L. Martinu. 3. Thin Film Analysis Using the Thermo VG Theta Probe Instrument; R.K. Champaneria, J. Wolstenholme. 4. Nanoindentation of Microsprings and Microcantilevers; M. Seto, et al. Low Permittivity Materials. 5. Physical and Interfacial Properties of Low Permittivity Polymers: Cyclotene, Silk and Ultra-Low K; D. Frye, et al. 6. Physical and Mechanical Properties of Silk Low Dielectric Film; J. Im. 7. Plasma-Polymerized Fluoropolymer Thin Films for Microelectronic Applications; M. Silverstein, et al. Polymer Metallization. 8. Fundamental Aspects of Polymer Metallization; F. Faupel, et al. 9. The Study of Copper Clusters on Dow Cyclotene and Their Stability; D.-Q. Yang, E. Sacher. 10. Adsorption of Noble Metal Atoms on Polymers; V. Zaporojtchenko, et al. 11. Nucleation and Growth of Vapor-Deposited Metal Films in Self-Assembled Monolayers Studied by Multiple Surface; A.V. Walker, et al. Barrier Layers. 12. Morphological Investigations of Low-k Polymer/Diffusion Barrier Interfaces for IC Metallization; S. Sankaran, R.E. Geer.13. Chemistry in the Initial Formation of Nitride Barriers on Low-k Dielectrics; P. Abramowitz, et al. 14. Capabilities and Limitations of RBS to Characterize Hyper-Thin Silicon Compounds on Various Polymeric Substrates; G. Dennler, et al. Adhesion Enhancement. 15. Surface Modifications by Ion-Assisted Reactions; S.K. Koh, et al. 16. Plasma and VUV Pretreatments of Polymer Surfaces for Adhesion Enhancement of Electrolessly Deposited Ni Or Cu Films; M. Romand, et al. Index