Thermal Management of Electronic Systems II: Proceedings of EUROTHERM Seminar 45, 20 22 September 19

Preface. 1: Invited Lectures. The Numerical Modelling of Heat Transfer in Electronic Systems: Challenges and Ideas of Answer; J. Saulnier. DELPHI: A Status Report on the ESPRIT Funded Project for the Creation and Validation of Thermal Models of Electronic Parts; H. Rosten. Temperature Effects on Reliability; M. Pecht. 2: Analytical and Computational Thermal Modeling. Numerical Simulation of Combined Conduction-Radiation Heat Transfer in PCB Assemblies for Space Applications: Experimental Validation; P. Lybaert, et al. Conjugate Model of a Pinned-Finned Heat-Sink Using a Hybrid Conductance and CFD Model within an Integrated MCAE Tool; D. Agonafer, A. Free. Analysis of 3D Conjugate Heat Transfer in Electronic Boards: Interaction between Three Integrated Circuits; B. Fourka, J.B. Saulnier. Heat Transfer in Tridimensional Plastic Packages Stacks of Memory Chips; Y. Scudeller, C. Val. Electrothermal Simulation of Analogue Integrated Circuits with ETS; W. Van Petegem, et al. Calculations of the Temperature Distribution Throughout Electronic Equipments by the Boundary Element Method; J.P. Fradin, B. Desaunettes. An Interactive Thermal Characterisation of Component Placement; J.L. Blanchard, S. Louage. 3: Thermal Characterisation. Thermal Characterisation of Electronic Devices by means of Improved Boundary Condition independent Compact Models; H. Vinke, C. Lasance. Experimental Validation methods for Thermal Models; W. Temmerman, et al. Experimental Thermal Characterisation of Electronic Packages in a Fluid Bath Environment; F. Christiaens, et al. Modelling of IC-Packages based on Thermal Characteristics; I. Ewes. Characterisation of Thermally Enhanced Plastic Packages; A. Björneklett, G. Gustavsson. Thermal Characterization of Multistripe Heterostructure Lasers; V. Lepaludier, Y. Scudeller. Application of Thermal Territories for Air Cooled Circuit Board Design; A. Mälhammar. Thermal Impedance Evaluation with Different Power Profiles; V. Motta. Thermal Characterisation and Modelisation of Multichip Modules Using Standard Electronic Packages; A. Belache, et al. Measurement of Practical Thermal Resistance Values for Multi- Cavities Power Hybrids (MCPH) in a Vacuum Environment; D. Petitjean, et al. 4: Single and Multi-Phase Convective Cooling. Boiling and Condensation Heat Transfer in Narrow Channels of Thermosiphons for Cooling of Electronic Components; N. Tengblad, B. Palm. Application of Phase Change Materials (PCMs) to the Passive Thermal Control of a Plastic Quad Flat Package: Effect of Orientation of the Package; D. Pal, Y. Joshi. High Performance Air Cooled Heat-Sinks for Power Packages; A. Aranyosi, et al. Thermal Control of Broadcast Transmitters by Air Cooled Cold Plates; G. Cesini, et al. Natural Convection Experiments with Cuboids and Cylinders of Equal Area; R. Van Es, C. Lasance. Natural Convection Heat Transfer of Metal Cuboids Flush-Mounted in a Horizontal Plate; J. Drabbels. 5: Measurement Techniques. Visualisation of Natural Convection in Inclined Heated Parallel Plates; O. Manca, et al. New Jedec Standards for Thermal Measurements: Review and Examples; V. Motta. Experimental Study on Local Convective Heat Transfer from Protruding Cubical Components; E. Meinders, et al. Modelling of Axial Fans for Electronic Equipment; J. Henissen, et al. 6: Thermomechanical Modelling. Thermal Degradation of Power Modules; L. Tielemans, et al. Thermal and Thermomechanical Modelling of Ball Grid Array Packages; T. Fromont. Thermal and Thermomechanical Evaluation of a `Chip in Moulded Interconnect Device'; F. Christiaens, et al. Thermal and Mechanical Characterization of Electronic Packages in Extremely High Frequency Applications by means of Finite Element Analysis; J.P Sommer, et al. Author Index.