Integrated Circuit Packaging, Assembly and Interconnections: Trends and Options
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- Artikel-Nr.: 10196433
Beschreibung
Electronic Manufacturing and the Integrated Circuit.- Integrated Circuit Manufacturing: A Technology Resource.- Packaging the IC-Single Chip Packaging.- The Chip Scale Package.- Multichip Packaging.- Known Good Die (KGD).- Packaging Options-Chip on Board.- Chip & Wire Assembly.- Tape Automated Bonding-TAB.- Flip Chip-The Bumping Processes.- Flip Chip Assembly.- HDI Substrate Manufacturing Technologies: Thin Film Technology.- HDI Substrate Manufacturing Technologies: Thick Film Technology.- HDI Substrate Manufacturing Technologies: Cofired Ceramic.- Substrate Manufacturing Technologies: Organic Packages and Interconnect Substrate.
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