Materials & Process Integration for MEMS

Contributors. Acknowledgements. Foreword. Preface. 1. Integration of Piezoelectric Pb (ZrxTi1-x)O3 (PZT) Thin Films into Micromachined Sensors and Actuators; P. Muralt, et al. 2. Porous Silicon as a Sacrificial Layer in Production of Silicon Diaphragms by Precision Grinding; A. Prochaska, et al. 3. GaAs Cantilever and Bridge Membrane-Like Structures Fully Compatible with AlGaAs/InGaAs/GaAs and InGaP/InGaAs/GaAs Based HFETs; T. Lalinsky, et al. 4. Magnetron Sputtered TiNiCu Shape Memory Alloy Thin Film for MEMS Applications; Yongqing Fu, Hejun Du. 5. Chemically Amplified Resist for Micromachining using X-Ray Lithography; T.L. Tan, et al. 6. Self-Assembled Monolayers (SAM) for Tunneling Sensors; F.E.H. Tay, et al. 7. Oxidation Process-Optimization for Large Area Silicon Fusion Bonded Devices and MEMS Structures; K.N. Bhat, et al. 8. Silicon Nanomachining by Scanning Probe Lithography and Anisotropic Wet Etching; J.T. Sheu, et al. 9. A Novel Bulk Micromachining Method in Gallium Arsenide; Dong-il 'Dan' Cho, et al.. 10. Deep X-Ray Lithography for MEMS-Photoelectron Exposure of the Upper and Bottom Resist Layers; V. Kudryashov, P. Lee. 11. Spray Coating Technology of Photoresist/Polymer for 3-D Patterning and Interconnect; A.B. Suriadi, et al. 12. Uncooled Infrared Image Sensor of Dielectric Bolometer Mode using Ferroelectric BST Thin Film Prepared by Metal Organic Decomposition; Hong Zhu, et al. 13. Tactical Grade MEMS Gyroscopes Fabricated by the SBM Process; Dong-il 'Dan' Cho, et al. 14. Plasma Etching Techniques to Form High-Aspect-Ratio MEMS Structures; Won Jong Yoo, et al. Index.