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Defect and Fault Tolerance in VLSI Systems: Volume 2


Defect and Fault Tolerance in VLSI Systems: Volume 2
168.16 CHF
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Lieferzeit: 7-14 Werktage

  • 10331866


Beschreibung

1 Models for VLSI Manufacturing Yield.- Fault-Free or Fault-Tolerant VLSI Manufacturing.- Yield Models - Comparative Study.- 2 Models for Defects and Yield.- A Unified Approach to Yield Analysis of Defect Tolerant Circuits.- Systematic Extraction of Critical Areas From IC Layouts.- The Effect on Yield of Clustering and Radial Variations in Defect Density.- 3 Implementation of Wafer Scale Integration.- Practical Experiences in the Design of a Wafer Scale 2-D Array.- Yield Evaluation of a Soft-Configurable WSI Switch Network.- ASP Modules: WSI Building-Blocks for Cost-Effective Parallel Computing.- 4 Fault Tolerance.- Fault-Tolerant k-out-of-n Logic Unit Network With Minimum Interconnection.- Extended Duplex Fault Tolerant System With Integrated Control Flow Checking.- Experience in Functional Test and Fault Coverage in a Silicon Compiler.- 5 Array Processors.- APES: An Evaluation Environment of Fault-Tolerance Capabilities of Array Processors.- Comparison of Reconfiguration Schemes for Defect Tolerant Mesh Arrays.- An Integer Linear Programming Approach to General Fault Covering Problems.- Probabilistic Analysis of Memory Repair and Reconfiguration Heuristics.- Arithmetic-Based Diagnostics in VLSI Array Processors.- 6 New Approaches and Issues.- Yield Improvement Through X-RAY Lithography.- Reliability Analysis of Application-Specific Architectures.- Fault Tolerance in Analog VLSI: Case Study of a Focal Plane Processor.- 7 Yield and Manufacturing Defects.- Yield Model With Critical Geometry Analysis for Yield Projection from Test Sites on a Wafer Basis With Confidence Limits.- SRAM/TEG Yield Methodology.- A Fault Detection and Tolerance Tradeoff Evaluation Methodology for VLSI Systems.- 8 Designs for Wafer Scale Integration.- A Hypercube Design on WSI.- An Efficient Reconfiguration Scheme for WSI of Cube-Connected Cycles With Bounded Channel Width.- A Communication Scheme for Defect Tolerant Arrays.

Eigenschaften

Breite: 216
Gewicht: 649 g
Höhe: 279
Länge: 20
Seiten: 316
Sprachen: Englisch
Autor: C. H. Stapper, Gabriele Saucier, V. K. Jain

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