RF and Microwave Microelectronics Packaging
168.16 CHF
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Lieferzeit: 7-14 Werktage
- Artikel-Nr.: 10340455
Beschreibung
Fundamentals of Packaging at Microwave and Millimeter-Wave Frequencies.- Low-Cost High-Bandwidth Millimeter Wave Leadframe Packages.- Polymeric Microelectromechanical Millimeter Wave Systems.- Millimeter-Wave Chip-on-Board Integration and Packaging.- Liquid Crystal Polymer for RF and Millimeter-Wave Multi-Layer Hermetic Packages and Modules.- RF/Microwave Substrate Packaging Roadmap for Portable Devices.- Ceramic Systems in Package for RF and Microwave.- Low-Temperature Cofired-Ceramic Laminate Waveguides for mmWave Applications.- LTCC Substrates for RF/MW Application.- High Thermal Dissipation Ceramics and Composite Materials for Microelectronic Packaging.- High Performance Microelectronics Packaging Heat Sink Materials.- Technology Research on AlN 3D MCM.
Eigenschaften
Breite: | 166 |
Gewicht: | 620 g |
Höhe: | 235 |
Länge: | 20 |
Seiten: | 285 |
Sprachen: | Englisch |
Autor: | Franklin Kim, Ken Kuang, Sean S. Cahill |
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