Reliability, Yield, and Stress Burn-In: A Unified Approach for Microelectronics Systems Manufacturin
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Beschreibung
Preface. 1. Overview of Design, Manufacture, and Reliability. 2. Integrating Reliability into Microelectronics Manufacturing. 3. Basic Reliability Concept. 4. Yield and Modeling Yield. 5. Reliability Stress Tests. 6. Burn-In Performance, Cost, and Statistical Analysis. 7. Nonparametric Reliability Analysis. 8. Parametric Approaches to Decide Optimal System Burn-In Time. 9. Nonparametric Approach and Its Applications to Burn-In. 10. Nonparametric Bayesian Approach for Optimal Burn-In. 11. The Dirichlet Process for Reliability Analysis. 12. Software Reliability and Infant Mortality Period of the Bathtub Curve. Epilogue: Cost-Effective Design for Stress Burn-In. References. Appendices: A. Notation and Nomenclature. B. Failure Modes for Parts. C. Common Probability Distributions. D. Simulation for U-Shaped Hazard Rate Curves. E. Sample Programs. Index.
Eigenschaften
Breite: | 172 |
Höhe: | 236 |
Länge: | 25 |
Seiten: | 394 |
Sprachen: | Englisch |
Autor: | aeho Kim, ei-Ting Kary Chien, Way Kuo |
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