Advanced Thermal Management Materials
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- Artikel-Nr.: 10366118
Beschreibung
Introduction to Thermal Management in Microelectronics Packaging.- Requirements of Thermal Management Materials.- Overview of Traditional Thermal Management Materials.-Development of Advanced Thermal Management Materials.- Properties of WCu, MoCu, Cu/MoCu/Cu High Performance Heat Sink Materials and Manufacturing Technologies.- Novel Methods for Manufacturing of W85-Cu Heat Sinks for Electronic Packaging Applications.- Improved Manufacturing Process of Cu/Mo70-Cu/Cu Composite Heat Sinks for Electronic Packaging Applications.- Al/SiC Thermal Management Materials.- Understanding of Laser, Laser diodes, Laser diode packaging and its relationship to Tungsten Copper.- Future Trend of Advanced Thermal Management Materials.
Eigenschaften
Breite: | 155 |
Gewicht: | 394 g |
Höhe: | 235 |
Seiten: | 156 |
Sprachen: | Englisch |
Autor: | Guosheng Jiang, Ken Kuang, Liyong Diao |
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