Microelectronics Packaging Handbook. Pt.1: Technology Drivers Part I
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Beschreibung
Part I: Foreword. Preface. Conversion Factors. Summary Contents. 1. Microelectronics packaging: An overview. 2. Package wiring and terminals. 3. Package electrical design. 4. Heat transfer in electronic packages. 5. Package reliability. 6. Package manufacture. Glossary and Symbols. Authors' Biographies. Index. Part II: 7. Microelectronics packaging: An overview. 8. Chip-to-package interconnection. 9. Ceramic packaging. 10. Plastic packaging. 11. Polymers in packaging. 12. Thin-film packaging. 13. Package electrical testing. 14. Package sealing and encapsulation. Part III: 15. Microelectronics packaging: An overview. 16. Package-to-board interconnections. 17. Printed-wiring board packaging. 18. Coated-metal packaging. 19. Connector and cable packaging. 20. Packaging of optoelectronics with electronics.
Eigenschaften
Breite: | 165 |
Gewicht: | 1222 g |
Höhe: | 242 |
Länge: | 46 |
Seiten: | 720 |
Sprachen: | Englisch |
Autor: | Alan G. Klopfenstein, Eugene J. Rymaszewski, Rao R. Tummala |
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