3D Stacked Chips: From Emerging Processes to Heterogeneous Systems
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- Artikel-Nr.: 10464830
Beschreibung
Introduction to Electrical 3D Integration.- Copper-based TSV - Interposer.- Multi-TSV Crosstalk Channel Equalization with Non-Uniform Quantization.- Energy Efficient Electrical Intra-Chip Stack Communication.- Clock Generators for Heterogeneous MPSoCs within 3D Chip Stacks.- Energy Efficient Communications Employing 1-Bit Quantization at the Receiver.- 2-nm Laser Synthesized Si-Nanoparticles for Low Power Memory Applications.- Accurate Temperature Measurement for 3D Thermal Management.- EDA Environments for 3D Chip Stacks.- Integrating 3D Floorplanning and Optimization of Thermal Through-Silicon Vias.- Introduction to Optical Inter- and Intraconnects.- Optical Through-Silicon Vias.- Integrated Optical Devices for 3D Photonic Transceivers.- Cantilever Design for Tunable WDM Filters based on Silicon Microring Resonators.- Athermal photonic circuits for optical on-chip interconnects.- Integrated Circuits for 3D Photonic Transceivers.- Review of interdigitated back contacted full heterojunction solar cell (IBC-SHJ): a simulation approach.-
Eigenschaften
Breite: | 157 |
Gewicht: | 554 g |
Höhe: | 234 |
Länge: | 21 |
Seiten: | 339 |
Sprachen: | Englisch |
Autor: | Gerhard Fettweis, Ibrahim (Abe) M. Elfadel |
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