Die-Attach Materials for High Temperature Applications in Microelectronics Packaging: Materials, Pro

INemi High Temperature Pb-Free Attach Material.- Historical Context & Processing of Sintered Ag.- Ag Sintering and Solder Solidification.- Sintered Silver for LED Applications.- Equipment and Automation of Sintering Silver En-Masse.- Development and Process Control of Sintered Ag in Production.- Thermal Mechanical Modeling for Sintered Silver and Solder Alloy.- Reliability and Failure Mechanism of Sintered Ag in Power Modules.- The compatibility and selectivity of Ag sintering die attach with various surface metallization.- Morphological changes in sintered silver due to atomic migration.- Electrical properties of sintered Ag and its relationship to microstructural evolution.- High Temperature Solder alloy for die attach.- Transient liquid phase bonding.- Sintered copper.