RF and Microwave Microelectronics Packaging II
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- Artikel-Nr.: 10509446
Beschreibung
Chapter1. Introduction to RF and Microwave Microelectronic Packaging.- Chapter2. Packaging of Transmit/Receive Modules.- Chapter3. 3D Transitions and Connections.- Chapter4. Electromagnetic Shielding for RF & Microwave Packages.- Chapter5. Design of C-Band Interdigital Filter and Compact C-band Hairpin Bandpass Film Filter on Thin Film Substrate.- Chapter6. Research on High-reliable Low-loss HTCC Technology Applied in Millimeter Wave SMT Package.- Chapter7. Chip Size Packaging (CSP) for RF MEMS Devices.- Chapter8. The challenge in packaging and assembly the advanced power amplifiers.- Chapter9. High Thermal Conductivity Materials - Aluminum Diamond, Aluminum Silicon Carbide, and Copper Diamond.- Chapter10. Advancement in High Thermal Conductive Graphite for Microelectronic Packaging.- Chapter11. Carbon nanotubes and graphene for microwave/RF electronics packaging.
Eigenschaften
Breite: | 154 |
Gewicht: | 292 g |
Höhe: | 236 |
Länge: | 12 |
Seiten: | 172 |
Sprachen: | Englisch |
Autor: | Ken Kuang, Rick Sturdivant |
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